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tungsten/dantų ėduonis
Nuoroda įrašoma į mainų sritį
8 rezultatus
Temperature controlled lid assembly for tungsten nitride deposition
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Prisijungti Registracija
BACKGROUND OF THE INVENTION
1. Field of the Invention
Embodiments of the invention generally relate to a temperature controlled lid assembly for a processing chamber and a method for depositing tungsten-containing materials on a substrate by vapor deposition processes.
2. Description of the Related
Solid propellant rocket motors employing tungsten alloy burst discs and methods for the manufacture thereof
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TECHNICAL FIELD
The following disclosure relates generally to solid rocket propellant motors and, more particularly, to solid propellant rocket motors employing tungsten alloy burst discs, as well as to tungsten alloy burst discs and methods for the manufacture thereof.
BACKGROUND
A common solid
Symmetric device with contacts self aligned to gate
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BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to a method of forming a conductive stud self-aligned to a gate structure of a semiconductor device (e.g., a field effect transistor), wherein the conductive stud is conductively coupled to a drain region, or a source
Symmetric device with contacts self aligned to gate
Straipsnius versti gali tik registruoti vartotojai
Prisijungti Registracija
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to a method of forming a conductive stud self-aligned to a gate structure of a semiconductor device (e.g., a field effect transistor), wherein the conductive stud is conductively coupled to a drain region, or a source
Semiconductor device embedded with pressure sensor and manufacturing method thereof
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TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor device embedded with pressure sensor and a manufacturing method thereof. More particularly, the present invention relates to a technology effectively applied to the size reduction of a semiconductor device embedded
Semiconductor device embedded with pressure sensor and manufacturing method thereof
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CROSS-REFERENCE TO RELATED APPLICATION
The present application claims priority from Japanese Patent Applications JP 2004-289476 filed on Oct. 1, 2004 and JP 2005-284013 filed on Sep. 29, 2005, the contents of which are hereby incorporated by reference into this application.
TECHNICAL FIELD OF THE
Weighted iron set
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TECHNICAL FIELD OF THE INVENTION
The present invention generally relates to sets of iron golf clubs, and more particularly, to sets of iron golf clubs that are comprised of significant tungsten weighting.
BACKGROUND OF THE INVENTION
In conventional sets of "iron" golf clubs, each club includes a
Methods for fabricating integrated circuits having improved metal gate structures
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TECHNICAL FIELD
The technical field relates generally to methods for fabricating integrated circuits, and more particularly relates to methods for fabricating integrated circuits with improved metal gate structures.
BACKGROUND
Transistors such as metal oxide semiconductor field effect transistors
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