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formaldehyde/atrophy

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3 结果
TECHNICAL FIELD The present invention relates to a polyacetal resin composition and resin molded articles made thereof. In particular, it relates to a colored polyacetal resin composition having excellent thermal stability, suppressed formaldehyde generation and suppressed deterioration in

Combinations of imazalil and silver compounds

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CROSS REFERENCE TO RELATED APPLICATIONS This application is the national stage of Application No. PCT/EP2007/052081, filed 6 Mar. 2007 (hereby incorporated by reference herein), which application claims priority from EPO Patent Application No. 06110745.4, filed 7 Mar., 2006. The present invention

Electrolytic copper plating liquid and the electrolytic copper plating method

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FIELD OF THE INVENTION This invention relates to the electrolytic copper plating liquid that contains the compound that includes sulfur atoms and a specific urea derivative, and also the electrolytic plating method that uses the said electrolytic copper plating liquid. BACKGROUND OF THE
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