resin/atrophy

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to polymerizable unsaturated polyester resin syrup compositions, to methods of curing such polymerizable unsaturated polyester resin syrup compositions in an alkaline admixture with significant quantities of aqueous alkali

BACKGROUND 1. Technical Field The present invention relates to a resin composition and a resin shaped product. 2. Related Art Conventionally, various resin compositions containing a cellulose ester resin have been provided and used for manufacturing various resin shaped products. SUMMARY According

BACKGROUND 1. Technical Field The present invention relates to a resin composition and a resin shaped product. 2. Related Art Conventionally, various resin compositions containing a cellulose ester resin have been provided and used for manufacturing various resin shaped products. SUMMARY According

BACKGROUND 1. Technical Field The present invention relates to a resin composition and a resin shaped product. 2. Related Art Conventionally, various resin compositions containing a cellulose ester resin have been provided and used for manufacturing various resin shaped products. SUMMARY According

BACKGROUND 1. Technical Field The present invention relates to a resin composition and a resin shaped product. 2. Related Art Conventionally, various resin compositions containing a cellulose ester resin have been provided and used for manufacturing various resin shaped products. SUMMARY According

CROSS-REFERENCE TO RELATED APPLICATION(S) This application is based on and claims priority under 35 U.S.C. 119 from Japanese Patent Application Nos. 2014-197375 filed on Sep. 26, 2014, 2014-196845 filed on Sep. 26, 2014, 2014-196852 filed on Sep. 26, 2014, 2014-197378 filed on Sep. 26, 2014, and

The present application is the national stage application under 35 U.S.C. .sctn.371 of International application No. PCT/JP2009/052532, filed Feb. 16, 2009; the application claims priority under 35 U.S.C. .sctn.119 to Japanese application No. 2008-035554, filed on Feb. 18, 2008, the contents of

CROSS REFERENCE TO RELATED APPLICATIONS This application is a National Stage of International Application No. PCT/JP2012/054270 filed Feb. 22, 2012, claiming priority based on Japanese Patent Application No. 2011-036128 filed Feb. 22, 2011, the contents of all of which are incorporated herein by

TECHNICAL FIELD The present invention relates to a polyacetal resin composition and resin molded articles made thereof. In particular, it relates to a colored polyacetal resin composition having excellent thermal stability, suppressed formaldehyde generation and suppressed deterioration in

TECHNICAL FIELD The invention according to the present application relates to a resin composition for forming an insulating layer of a printed wiring board, a resin coated copper foil and a method for manufacturing the resin coated copper foil. The invention particularly relates to a resin coated

TECHNICAL FIELD The present invention relates to a surface treated calcium filler for resins and a resin composition containing the filler. The surface treated calcium filler for resins of the present invention has excellent dispersibility, and therefore when added to a porous film, for example,

CROSS-REFERENCE TO RELATED APPLICATIONS This application is the National Stage of International Application No. PCT/JP2011/077337, filed Nov. 28, 2011, which claims the benefit of Japanese Application No. 2010-276648, filed Dec. 13, 2010, the contents of which are incorporated by reference

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to apatite-based chromatographic resins and their use in the purification of proteins and other target molecules from biological samples. 2. Description of the Prior Art Apatite in its various forms, examples of which are

TECHNICAL FIELD The present invention relates to a contacting part made of a thermoplastic resin composition with reduced squeaking noises, and more particularly, to a contacting part made of a thermoplastic resin composition, which have been remarkably reduced in squeaking noises caused by coming

TECHNICAL FIELD The present invention relates to a contacting part made of a thermoplastic resin composition with reduced squeaking noises, and more particularly, to a contacting part made of a thermoplastic resin composition, which have been remarkably reduced in squeaking noises caused by coming